B300 Liquid
Cooling Solution
Full Liquid Cooling Coverage for The Chassis:
The Cold Plate Module solution provides full liquid cooling for NVS/GPU/HSCC/CX8/optical modules.
Unique Fluid Distribution Technology:
Total pressure drop < 40 kPa, with otimized flow rate allocation for each chip; flow uniformity deviation of GPU cold plates is within 5 %.
Mid-mounted Manifold Architecture:
Minimizes pipeline length for more stable flow rate, and the compact overall layout is suitable for high-density chassis deployment.
| Key Parameters | Parameter Description | ||
| Dimensions | 2U | ||
| Coolant | DI water, PG25 | ||
| Inlet Temperature | 45 ℃ | ||
| Flow Rate | 14 LPM | ||
| Pressure Drop | ≤40 kPa | ||
| NVS Power Consumption | 375 W | ||
| GPU Power Consumption | 1100 W | ||
| GPU Tcase | 84 ℃ | ||
| NVS Cold Plate Quantity | 2 | ||
| GPU Cold Plate Quantity | 8 | ||
| Quick Connector | UQD08 Plug | ||
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Note: Performance may vary depending on operating conditions. For data not listed, please contact TeraCule. |
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