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B300 Liquid Cooling Solution B300 Liquid Cooling Solution

B300 Liquid
Cooling Solution

Product Introduction

B300 Liquid Cooling Solution
B300 Liquid Cooling Solution

B300 Liquid Cooling Solution

Full Liquid Cooling Coverage for The Chassis:
The Cold Plate Module solution provides full liquid cooling for NVS/GPU/HSCC/CX8/optical modules.

Unique Fluid Distribution Technology:
Total pressure drop < 40 kPa, with otimized flow rate allocation for each chip; flow uniformity deviation of GPU cold plates is within 5 %.

Mid-mounted Manifold Architecture:
Minimizes pipeline length for more stable flow rate, and the compact overall layout is suitable for high-density chassis deployment.

Technical Specifications

Key Parameters Parameter Description
Dimensions 2U
Coolant DI water, PG25
Inlet Temperature 45 ℃
Flow Rate 14 LPM
Pressure Drop ≤40 kPa
NVS Power Consumption 375 W
GPU Power Consumption 1100 W
GPU Tcase 84 ℃
NVS Cold Plate Quantity 2
GPU Cold Plate Quantity 8
Quick Connector UQD08 Plug

Note: Performance may vary depending on operating conditions. For data not listed, please contact TeraCule.

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