GB200 Liquid
Cooling Solution
Copper cold plates ensure excellent thermal conductivity and oxidation resistance with dedicated surface treatment.
High-density microchannel structures enable powerful heat dissipation performance.
The stainless steel corrugated tube liquid cooling loop ensures enhanced stability and eliminates the need for frequent fluid replenishment.
T20 spring-loaded screws are compatible with NVIDIA standard screw interfaces.
High-power heat pipes cover all global hot spots.
The external UQDB04 combined with a floating module structure enables highly efficient and convenient assembly and maintenance.
Fully compatible with 2U chassis.
Easy Maintenance
High Heat Flux Handling Capacity
High Reliability
Low Evaporation Rate
Low Flow Resistance
| Key Parameters | Parameter Description | ||
| Dimensions | 2U | ||
| Coolant | DI water, PG25 | ||
| Inlet Temperature | 40 ℃ | ||
| Flow Rate | 2.85 LPM | ||
| Pressure Drop | ≤40 kPa | ||
| GPU Chip Thermal Resistance | ≤0.018 ℃/W @ 2.85 LPM | ||
| GPU Chip Power Consumption | 1200 W*4 | ||
| CPU Thermal Resistance | ≤0.06 ℃/W @ 2.85 LPM | ||
| CPU Power Consumption | 300 W*2 | ||
| Quick Connector | UQD04 Socket | ||
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Note: Performance may vary depending on operating conditions. For data not listed, please contact TeraCule. |
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