TH6 Chip Liquid
Cooling Product
Advanced 3D Printing Technology:
Integrally formed for reliable, leak-free performance.
Flexible 3D Flow Channels:
Designed to effectively address local hot spots.
Equipped with Double-Layer Sleeves:
Protects the main pipeline for enhanced durability and reliability. PTFE tubing enables more flexible layout.
| Key Parameters | Parameter Description | ||||
| Dimensions | 2U | ||||
| Coolant | DI water, PG25 | ||||
| Inlet Temperature | 40 ℃ | ||||
| Flow Rate | 2.4 LPM | ||||
| Pressure Drop | ≤8 kPa | ||||
| Power Consumption | 1663 W | ||||
| Thermal Resistance | 0.014 ℃/W（without Pad） | ||||
| Tcase | 63.3 ℃ |
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Note: Performance may vary depending on operating conditions. For data not listed, please contact TeraCule. |
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