Exceptional Heat Dissipation:
Each unit can handle up to 6.4 kW of server heat load.Combined with a high-density microchannel flow design and patented 3D jet technology, fluid distribution is precise and efficient.

Low Resistance and High Efficiency:
With a thermal resistance of less than 0.027 ℃/W and flow resistance below 15 kPa, the product improves on comparable industry products by over 10 %.

Comprehensive Safety Protection:
Equipped with a leak detection and alarm system covering all potential risk points, the product provides real-time monitoring of leakage risks.

Highly Compatible and Adaptable:
Precisely designed for 2U standard chassis, with T15 spring screws fully compliant with NVIDIA standard interfaces Customizable rubber tubing length allows flexible adaptation to various rack layouts.

Distinctive Aesthetic Design:
The oxygen-free copper base with surface coating combines visual appeal with oxidation resistance.

Customized Service Options:
The manifold offers multiple inlet and outlet specifications, allowing flexible customization based on data center computing layout, supporting cooling needs of different scales.