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    Why TeraCule

    TeraCule directly addresses the challenges of computational density and energy consumption posed by AIGC. We specializing in providing end-to-end design, delivery, and operation services--from chips to data centers--for AI chips with TDP greater than 1,000W. We are your "liquid cooling architect", building efficient, reliable, and green computing infrastructure.

    Constant Temperature
    Liquid Supply

    Prefabricated
    Construction

    Convenient Operation
    and Maintenance

    Low TCO

    Case Studies

    Muti-Layer Jet Applied in H200 Cold Plate: The thermal resistance (junction-to-fluid) is less Than 0.035 °C/W

    Muti-Layer Jet Applied in H200 Cold Plate: The thermal resistance (junction-to-fluid) is less Than 0.035 °C/W

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    The Test Result of H200 Cold Plate Modules

    The Test Result of H200 Cold Plate Modules

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    Test Results of GB200 Cold Plate Modules

    Test Results of GB200 Cold Plate Modules

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    IM AI Data Center (Design Stage)

    IM AI Data Center (Design Stage)

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    Guangdong, Computing Center, 2000P & H800

    Guangdong, Computing Center, 2000P & H800

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    102.4T Switch Cold Plate

    102.4T Switch Cold Plate

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